Diamond grinding tools for machining wafers (silicon) in the microchip industry. For an optimum result we recommend grinding tools with diamond in resin and vitrified bonding systems.
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The product assortment for backgrinding of wafers allows to reach highest quality surfaces with a significant improved Die Strength Ratio. The composition of optimized diamond quality, special bond system and an unique core design produced with an innovative production technology at Asahi, guarantees lowest grinding forces during the grinding process. In combination with specific process adjustments an outstanding economic efficiency can be reached. Show more Show less